INSETO UK LTD
- UNIT 25 FOCUS WAY
SP10 5NY ANDOVER, HAMPSHIRE
Phone: +44 (0)1264 334505
Fax: +44 (0)1264 334449
E-mail: Send messagewww.inseto.co.uk
Short profile:
Equipment, materials for electronics, microelectronics, surface mount, wire bonders, solder reflow, smt pick and place, selective solder, UV adhesives.
Inseto, founded in 1987, provide advanced manufacturing equipment, assembly materials and related consumable products for electronic production, including Semiconductor, Micro & Nanoelectronic Assembly, as well as products for general industrial manufacturing.
Detailed description:
A comprehensive range of technical adhesives for automotive, electronic and general manufacturing industries.
Provides assembly, test & inspection equipment for the microelectronic, photonic and semiconductor industries.
For assembly materials and machine consumables used in semiconductor, photonic and hybrid assembly etc.
Inseto provide high technology adhesives from DELO, including conductive epoxies, UV cured adhesives, light curing epoxies & light cure acrylics, cyanoacrylates instant adhesives, polyurethane adhesives, anaerobic adhesives, one and two part structural and casting epoxies, silicone sealants and adhesives, plus dispensing systems and UV curing lamps.
Microelectronics Equipment Division
Inseto's Microelectronics Equipment Division provides manufacturing equipment for the Microelectronic, Photonic, Nanoelectronic, Solar Cell and Semiconductor industries including probing systmes, dicing and scribing machines, die and wire bonders, plasma cleaners, ovens & vacuum soldering systems, material testers for pull & shear testing, microscopes, automatic inspection systems for wafers and high power test systems etc.
Microelectronics Materials Division
Inseto's Microelectronics Materials Division provides assembly materials and machine consumable items for the semiconductor, photonic and hybrid assembly industries. Products include gold, aluminium, copper and silver bonding wires and bonding ribbons, precision metal stampings, solder preforms, hermetic glass & ceramic sealed packages, thick film materials (thick film inks), metalised thin film and precision machined ceramics, thermal dissipation materials, and die / wire bond assembly consumables including wedges, capillaries and collets, dicing blades etc.
Keywords:
wire bond testers, copper tungsten, convection ovens, die bonders, etched metal parts, capillaries and collets, pcb cleaning systems, Electronic Component Supplies, Electronic Component, aqueous cleaning, producing Electronic Component, ADHESIVE, MoCu, anaerobic adhesives, wire bonders, bond shear testers, CuMo, curing ovens, precision metal stampings, hermetic packages, cleaning systems, thick film inks, adhesives, Electronic Manufacturers, light cured, laser bar handling, ELECTRONIC EQUIPMENT COMPONENTS INSTRUMENTS, wedges, Electronic Component Companies, wafer inspection, solder reflow ovens, die sorters, making Electronic Component, microelectronic automation equipment, vapour degreasing, copper moly, thick film materials, uv cured, lead free solder paste, dicing blades, SMT pick and place, cyanoacrylates, CURING LAMPS, CuW, flip chip underfill, epoxies, selective soldering systems, wafer mounters, hot bar soldering tools, die pick and place, photonics assembly equipment